This product is a semiconductor wafer cleaning agent carefully formulated from various raw and auxiliary materials with strong cleaning ability. It has excellent ability to remove organic pollutants, metal pollutants, fine particles, and oxides on the chip, without corrosion to the semiconductor substrate and coating metal, without ammonia nitrogen and phosphorus, with a working solution COD<500ppm, environmentally safe, and simple wastewater treatment.

a) Economy: This product is a concentrated solution that can be diluted 20 times, with high economic value.

b) Efficiency: It can quickly dissolve foreign objects on the chip and cause them to fall off, making the operation simple and convenient.

c) Safety: No corrosion to wafer substrate and coating lines.

d) Environmental friendliness: It does not contain prohibited substances such as ammonia nitrogen and phosphorus, and is an environmentally friendly product.

Method of using：

According to actual working conditions, immersion cleaning, ultrasonic cleaning, and other methods can be used. It is generally recommended to use the original solution to heat up to 45 ℃~65 ℃ to clean semiconductor wafers. The cleaning time can be controlled within about 3min~10min according to the actual situation; After cleaning, use deionized water and then ultrapure water to clean. The frequency and time of cleaning are determined by the on-site process requirements.

Notes：

Do not touch the skin for a long time. If it accidentally splashes into the eyes, please rinse it with water in a timely manner.